laser bonding

The three dimensional temperature distribution of laser bonding with a Gaussian thermal source is modeled using the finite element method. Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding

在硅／玻璃激光键合中，温度场的分布是影响晶片能否键合的关键因素。用低温圆片键合实现传感器和微电子机械系统器件的集成和封装

The bonding methods used in micro assembly includes adhesive bonding, thermal bonding, solvent bonding, laser bonding, etc, which have limits in some respects.

目前应用于聚合物微装配的联接方法主要有胶粘接、热键合、溶剂键合、激光键合等，以上方法均在某些方面存在着各自的局限性。

The three dimensional temperature distribution of laser bonding with Gaussian thermal resource is modeled by using finite element method.

利用有限元法建立了移动高斯热源作用下硅/玻璃激光键合的三维温度场数值分析模型。

Application and Research Progress of Laser Bonding Technology in Packaging

激光键合技术在封装中的应用及研究进展